The semiconductor industry produces critical components for the technologies we rely on for survival. The industry is seeking faster, smaller, more powerful, more precise, and more efficient processes. UV laser cutting perfectly meets these needs.
UV lasers can process a variety of materials, such as silicon-based semiconductors like SIC and two-dimensional materials like graphene.
Using lasers to process these materials can add significant value to the entire semiconductor supply chain.
Our newly designed and manufactured ultraviolet laser cutting equipment achieved a minimum precision error of 0.05mm in graphene cutting tests, with excellent cutting results, no chipping, no deformation, and a high yield rate.